DANOPREN is a rigid extruded polystyrene (XPS) foam board with shiplap edges and is available in various thicknesses. Manufactured without CFC's, HCFC's or HFC's, the boards have long-term high compressive and mechanical strength and are robust enough to withstand round handling during transport and installation without losing their physical integrity or their performance as thermal insulation. Danosa Danopren TR60 Specification Length: 1.25mWidth: 0.6mThickness: 60mmm2 Per package: 5.25Pack Quantity: 7 BoardsThermal Conductivity: 0.034 W/mK For further information please refer to data sheet